Cambodia and the US have recently reached a cooperation agreement on acceleration of patent processing. Cambodia has signed similar agreements so far with Singapore, Japan, the EU, China, and Korea since 2016.
Thanks to the agreement, US patents could get protected in Cambodia faster, via validation or re-registration procedures, or accelerate patent decisions for corresponding patent applications filed in Cambodia.
It is expected that Cambodia will issue a praka (Cambodian guiding document) on requirements and procedures in implementation of such agreement.
This is rather a good effort from Cambodia in attracting foreign investment amid economic disruption due to the global pandemic, and especially after the EU has temporarily lifted the EBA preferential treatment enjoyed by Cambodia in connection with its access to the EU market.
Both sides spoke highly of the joint effort to reach the agreement expected to attract more U.S. investors to Cambodia. Patrick Murphy underlined the long-lasting relations between Cambodia and the U.S., adding that this year is the 70th anniversary of diplomatic relations between the two countries. The virtual event is another move to further boost Cambodia’s economic growth and the confidence of U.S. investors to come to Cambodia, continued the U.S. diplomat.
https://www.khmertimeskh.com/50776430/cambodia-u-s-sign-mou-on-patent-cooperation/
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